With the rapid development of smart phone and fast change of market demand, the screen size of smart phone is increasingly larger and its frame is becoming increasingly narrower, raising requirements for reliability. Under this background, most of the international smart  phone manufacturers turn to apply reactive hot-melt adhesive solution. Reactive hot-melt adhesive features fast-curing and ultra-high strength characteristics. Hence, it adapts to efficient automatic production rhythm and provide very high strength within limited area, enhancing impact-resistance, tightness and reliability of the phone.