Weldtone supplies both first level and second level underfill products for electronic applications. These underfill products are one-component, heat-curable, reworkable epoxy base adhesives. They are designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.
Underfill adhesives Series | |||||||
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Product Name | Appearance | Description | Viscosity (cPs@25℃) | Curing Condition | Elongatin(%) | Tg by TMA (°C) | More parameters |
UF2002 | Black Liquid | 2nd level underfill
Fast flow at room temperature
No voiding
Reworkable
Excellent reliability
|
300-600 | 10 min at 130°C | 108.0 | 60 | Detailed introduction |
UF2101 | Black Liquid | 1st level underfill
Fast flow at room temperature
Fast curing
High Tg, low CTE
|
8,000-11,000 | 10min at 150°C | 160.0 | 30 | Detailed introduction |
UF2100 | Black Liquid | 1st level underfill
Fast curing
Reworkable
Excellent TC performance
|
4,000-7,000 | 10min at 150°C | 130.0 | 25 | Detailed introduction |
UF7001 | Black | Fast flow at room temperature
Fast curing
Excellent reliability
Reworkable
|
300-500 | 8 min at 130°C | 2.6 | 106 | Detailed introduction |
UF1018 | Black | Fast flow at room temperature Fast cure Excellent reliability Reworkable |
300-600 | 8 min at 130°C | 2.5 | 105 | Detailed introduction |