Products

Underfill adhesives

Weldtone supplies both first level and second level underfill products for electronic applications. These underfill products are one-component, heat-curable, reworkable epoxy base adhesives. They are designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.

Benefits

Fast cure at low temperature
Excellent reliability
Fast flow at room temperature and suitable for automatic assembly lines
Reworkable

Underfill adhesives Series
Product Name	Appearance	Description	Viscosity (cPs@25℃)	Curing Condition	Elongatin(%)	Tg by TMA (°C)	More parameters
UF2002	Black Liquid	2nd level underfill Fast flow at room temperature No voiding Reworkable Excellent reliability	300-600	10 min at 130°C	108.0	60	Detailed introduction
UF2101	Black Liquid	1st level underfill Fast flow at room temperature Fast curing High Tg, low CTE	8,000-11,000	10min at 150°C	160.0	30	Detailed introduction
UF2100	Black Liquid	1st level underfill Fast curing Reworkable Excellent TC performance	4,000-7,000	10min at 150°C	130.0	25	Detailed introduction
UF7001	Black	Fast flow at room temperature Fast curing Excellent reliability Reworkable	300-500	8 min at 130°C	2.6	106	Detailed introduction
UF1018	Black	Fast flow at room temperature Fast cure Excellent reliability Reworkable	300-600	8 min at 130°C	2.5	105	Detailed introduction