Products

Underfill adhesives

Weldtone supplies both first level and second level underfill products for electronic applications. These underfill products are one-component, heat-curable, reworkable epoxy base adhesives. They are designed to improve the reliability of fine–pitch chip scale package (CSP) and wafer level packaging (WLCSP) assembly, and are suitable for automatic production line of customers.

Benefits


Underfill adhesives Series
Product Name Appearance Description Viscosity (cPs@25℃) Curing Condition Elongatin(%) Tg by TMA (°C) More parameters
UF2002 Black Liquid 2nd level underfill
Fast flow at room temperature
No voiding   
Reworkable 
Excellent reliability     
300-600 10 min at 130°C 108.0 60 Detailed introduction
UF2101 Black Liquid 1st level underfill
Fast flow at room temperature
Fast curing
High Tg, low CTE
8,000-11,000 10min at 150°C 160.0 30 Detailed introduction
UF2100 Black Liquid 1st level underfill
Fast curing
Reworkable
Excellent TC performance
4,000-7,000 10min at 150°C 130.0 25 Detailed introduction
UF7001 Black Fast flow at room temperature
Fast curing
Excellent reliability 
Reworkable
300-500 8 min at 130°C 2.6 106 Detailed introduction
UF1018 Black Fast flow at room temperature
Fast cure
Excellent reliability
Reworkable
300-600 8 min at 130°C 2.5 105 Detailed introduction